日: 2025年3月31日

Solder Reflow: An In-Depth Guide to the Process and Techniques

This article provides a detailed overview of the solder reflow process, types of reflow ovens, temperature profiles, solder paste composition and selection, reflow process potential challenges, solutions, inspection, and quality control techniques. Reflow soldering furnace used on mounted PCB Introduction Solder reflow is a critical process in the electronics industry, primarily used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven. The solder paste melts, forming a reliable electrical and mechanical connection between the component and the PCB. The quality of these connections has a significant […]