The factory for assembling electronic products mainly includes two production lines: SMT surface assembly and DIP plug-in assembly. SMT is the process of attaching electronic components onto a PCB circuit board through a device, then heating them in a furnace (usually referred to as a reflow soldering furnace), and fixing the components onto the PCB board through solder paste soldering; And DIP has some large connectors that cannot be connected to the PCB board by devices, so it needs to be plugged into the PCB board by humans or other automated devices.   In the production process of SMT and DIP, various factors can lead to some quality problems in the products, […]

During SMT processing, electrostatic discharge can cause damage or failure to electronic components. With the improvement of IC integration and the gradual reduction of components, the impact of electrostatic discharge becomes increasingly severe. According to statistics, static electricity accounts for 8% to 33% of the factors that lead to the failure of electronic products, and the annual loss of electronic products caused by static electricity can reach billions of dollars. Therefore, implementing electrostatic protection measures is very important in SMT production. This article will provide a detailed introduction to how to take effective electrostatic protection measures from the generation of static electricity to the protection of components and scenes. How […]

What is Impedance Control and Signal Matching Impedance control is matching PCB trace dimensions and locations with the properties of the substrate material to make sure that the strength of a signal traveling along a trace is within a required range. The continual increase in device switching speeds is confronting engineers with signal integrity(SI) problems and eventually, most devices are going to have to deal with SI issues. So, Printed Circuit Board(PCB) traces can no longer be treated as a simple point-to-point connection. Traces need to be considered as transmission lines and impedance matching becomes necessary to lessen or eliminate the impact on SI. By following good design practices and approaches, many potential signal integrity issues can be averted or mitigated. So, here we’ll talk […]

PCB boards are usually composed of multiple layers stacked together, with each layer performing a different function. The following are common PCB layers and their meanings: Signal layer: The signal layer is one of the most important layers on the PCB board. It contains the signal transmission path between electronic components and realizes signal transmission and communication through the connection between wires and electronic components. Generally, PCB boards will have multiple signal layers for wiring and connecting complex circuits. Stratum: The stratum is the layer designed to provide a good ground reference. It is mainly used to form a large-area ground plane to provide low noise, low impedance and electromagnetic […]

1.Incoming Inspection Incoming inspection refers to the confirmation and verification of the quality of purchased raw materials, components, or products, that is, the quality is inspected through sampling when the supplier sends the raw materials or components, and the final judgment is made whether the batch of products is accepted or rejected. 2.Meaning IQC is the first quality control level for enterprise products before production. If unqualified products are placed in the manufacturing process, it can lead to unqualified processes or final products, causing huge losses. IQC not only affects the quality of the company’s final products, but also affects various direct or indirect costs.     In the manufacturing industry, the […]

PCBスタックアップとは何ですか？通常、通常の片面または両面基板を設計する場合、PCBの積層問題を考慮する必要はありません。通常、設計要件を満たす銅厚と板厚の銅張基板を直接選択して直接加工します。しかし、4層以上のPCBを設計する場合、積層設計はPCBの性能と価格に直接影響します。 16層基板の積層設計 多層PCBは、銅張コア基板（Core）、プリプレグ（PP）、銅箔から構成され、積層設計に従って組み合わせ、圧着します。PCB設計を開始する前に、レイアウトエンジニアは [...] 続きを読む

SMT小ロットパッチ加工工場のSMTパッチプルーフィングが完了した後、テスト、組み立てなどのいくつかのフォローアップ加工手順が必要です。すべての電子加工リンクが完了した後、顧客に納品される。納品と輸送の過程で、ぶつかる、ぶつかる、摩擦などの様々な要因によって比較的簡単に妨害される。では、SMTで加工された回路基板が破損せず、安全に顧客の手元に届くように、PCBA工場はどのように輸送すればよいのでしょうか。SMTチップ加工の利点：組立密度が高く、電子製品のサイズが小さく、重量が軽い、チップの体積と重量 [...]...

すべてのPCBアセンブリメーカーは、適切な洗浄基準を遵守する必要があります。今、回路基板の清浄度要件の外観は、ボードの作業に影響を与えることなく、ますます厳しくなっている、私たちのDYC工場は、各顧客にきれいな回路基板を提供するために懸命に働いてきました。 1.IPC-5704に準拠 すべての医療機器の開発は、品質管理基準の特定のセットを満たす必要があります。IPC-5704は、特に未組立プリント基板の製造のための清浄度要件に対処する一連の規格です。