The factory for assembling electronic products mainly includes two production lines: SMT surface assembly and DIP plug-in assembly. SMT is the process of attaching electronic components onto a PCB circuit board through a device, then heating them in a furnace (usually referred to as a reflow soldering furnace), and fixing the components onto the PCB board […]

During SMT processing, electrostatic discharge can cause damage or failure to electronic components. With the improvement of IC integration and the gradual reduction of components, the impact of electrostatic discharge becomes increasingly severe. According to statistics, static electricity accounts for 8% to 33% of the factors that lead to the failure of electronic products, and […]

What is Impedance Control and Signal Matching Impedance control is matching PCB trace dimensions and locations with the properties of the substrate material to make sure that the strength of a signal traveling along a trace is within a required range. The continual increase in device switching speeds is confronting engineers with signal integrity(SI) problems and eventually, most devices are going to have to deal with SI issues. So, Printed […]

PCB boards are usually composed of multiple layers stacked together, with each layer performing a different function. The following are common PCB layers and their meanings: Signal layer: The signal layer is one of the most important layers on the PCB board. It contains the signal transmission path between electronic components and realizes signal transmission […]

1.Incoming Inspection Incoming inspection refers to the confirmation and verification of the quality of purchased raw materials, components, or products, that is, the quality is inspected through sampling when the supplier sends the raw materials or components, and the final judgment is made whether the batch of products is accepted or rejected. 2.Meaning IQC is […]

What is PCB stackup? Under normal circumstances, when designing ordinary single or double-sided boards, there is no need to consider the lamination problem of the PCB. Usually, a copper-clad board with a copper thickness and a plate thickness that meets the design requirements is directly selected for direct processing. However, when designing a PCB with […]

После завершения проверки SMT патчей на заводе по обработке SMT патчей малых партий, необходимо выполнить некоторые последующие процедуры обработки, такие как тестирование, сборка и т.д. После завершения всех звеньев электронной обработки он доставляется заказчику. Это относительно легко быть нарушены различные факторы в доставке и транспортировке [...].

Каждый производитель печатных плат должен придерживаться надлежащих стандартов очистки. Теперь внешний вид печатной платы чистоты требования все более и более строгими, не влияя на работу платы, наша фабрика DYC упорно трудится, чтобы доставить чистую печатную плату для каждого клиента。 1.Соблюдать IPC-5704 Все медицинские устройства развития [...]...